Quantcast Appendix B Supplement Bibliography -Cont. - hdbk419a_vol10358

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47. Clark, D. B. and Lassiter, H. A., "Nuclear Electromagnetic Pulse (NEMP) Protection for Communications
Facilities and Equipment," 1968 WESCON Proceedings, Vol 12, Pt 4, Session 19/4, IEEE, New York NY.
48. Clifton, Harvey W., "Design Your Grounding System," I IEEE Trans on Aerospace, Vol 2, No. 2, April 1964, pp
49. Coe, James C., "Electrical Interference in Instrumentation - Its Causes and Remedies (Parts 1 and 2)," ISA
Journal, November 1954, pp 49-50 (Part I), and December 1954, pp 33-35 (Part 2).
50. Coleman, O. K., "Why Ground," Electrical Engineering, Vol 75, No. 5, May 1956, pp 418-424.
51. Coleman, W. E. and Frostick, H. G., "Electrical Grounding and Cathodic Protection at the Fairless Works,"
AIEE Trans, Vol 74, Pt II, March 1955, pp 19-24.
52. "Comparative Properties of Grounding Electrodes," Engineering Reference Sheet No. 48-5, Electrical
World, Vol 129, January 1948, p 72.
53. Compton, K. G., "Electrical Measurements and Their Interpretation In Underground Cable Corrosion
Problems," Corrosion, Vol 14, No. 5, May 1958, pp 237t - 244t.
54. Connor, T. J. and Wilson, W. R., "Performance of Electrical Joints Utilizing New Silver Coating on
Aluminum Conductors," AIEE Trans, Vol 72, Pt III, August 1953, pp 702-712.
55. "Control of External Corrosion on Underground or Submerged Metallic Piping Systems, Recommended
Practice," NACE Standard RP-01-69, National Association of Corrosion Engineers, 2400 West Loop South,
Houston TX 77027.
56. "Corrosion Control Aspects of Underground Residential Electrical Distribution Systems: Materials
Protection and Performance, Vol 10, No. 1, January 1971, pp 38-40.
57. Dahnke, J. E., "Considerations and Techniques in Allotment of EMP Protection Requirements to Subsystem
End Items in Well-Shielded Ground-Based Systems," TRW Inc, San Bernandino CA. Copies available from
USAEC Technical Information Center, PO Box 62, Oak Ridge TN 37830.
58. Davidson, G. G. and Hunter, E. T., "Characterization of EMP Protection Devices," ECOM-4128, US Army
Electronics Command, Fort Monmouth NJ, July 1973, AD 763 886.
59. Demrow, R. I., "Protecting Data from the Ground Up," Electronics, Vol 41, No. 9, April 1968, pp 58-64.
60. Dimarzio, Alfred W., "Behavior of Conductive Epoxy for Shielding and Bonding," Frequency Technology,
Aug/Sept 1970, pp 18-23.
61. Dixon, C. R. and Nelson, F. G., "The Effect of Elevated Temperature of Flash-Welded Aluminum Copper
Joints," AIEE Trans, Vol 78, Pt II, 1959, pp 491-495.


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