Figure 1-52. Elements of the Facility Ground System (with Grid)

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Copper Grid Embedded in Concrete

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Grounding, Bonding, and Shielding for Electronic Equipments and Facilities

Raised (Computer) Flooring

MIL-HDBK-419A

EQUIPMENT CABINETS

BONDED TO EQUIPMENT

GROUND PLATES OR TO

STRUCTURE

Figure 1-52. Elements of the Facility Ground System (with Grid)

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