Quantcast Figure 2-12. Bond Resistance Measurement Technique

Share on Google+Share on FacebookShare on LinkedInShare on TwitterShare on DiggShare on Stumble Upon
Custom Search
 
  
 


MIL-HDBK-419A
b.
Equipment Setup and Test Procedure.
Connect the current probe, current probe amplifier, and oscilloscope as shown in Figure 2-13.
(1)
Observe the oscilloscope-displayed ambient level at each test point.
(2)
Photograph the ambient level at each test point.
(3)
Set the oscilloscope to trigger at a level slightly above the ambient.
(4)
Set the oscilloscope for single sweep operation and open the camera shutter.
(5)
Figure 2-12. Bond Resistance Measurement Technique
2-21





 


Privacy Statement - Copyright Information. - Contact Us

Integrated Publishing, Inc.