Facility Maintenance Procedure (Signal Reference Subsystem (Signal Grounding)).
TECHNICAL DATA REFERENCES:
Grounding, Bonding, and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
RELATED MAINTENANCE PROCEDURE:
APPLICABLE TEST PROCEDURES:
Bond Resistance Test (see Section 220.127.116.11.1).
Ground System Noise Current Test (see Section 18.104.22.168.2).
Differential Noise Voltage Test (see Section 22.214.171.124.3).
TEST EQUIPMENT REQUIRED:
milliohm, 10 milliohms, and 100 milliohms.
Isolation Transformer for Oscilloscope.
Clamp-on Current Probe for Oscilloscope.
Required lengths of coaxial cable for oscilloscope probes.
Film for oscilloscope camera.
Follow the inspection and test procedures set forth in Sections 126.96.36.199.5 and 188.8.131.52.6.
Record the results of the inspection and measurements in Part V of the Facility Maintenance
File Major Discrepancy Reports as needed.