Figure 7-6. Typical Bond Configurations Which Can Be Implemented With The Exothermic Process

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Figure 7-5. Typical Exothermic Connections

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Grounding, Bonding, and Shielding for Electronic Equipments and Facilities

Bolts

MIL-HDBK-419A

COURTESY OF ERIC0 PRODUCTS, INC., CLEVELAND, OHIO

Figure 7-6. Typical Bond Configurations Which Can Be Implemented With The Exothermic Process

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Integrated Publishing, Inc. - A (SDVOSB) Service Disabled Veteran Owned Small Business