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 MIL-HDBK-419A
2.3.2.6
Facility Maintenance Procedure (Shielding).
1.
TECHNICAL DATA REFERENCES:
Grounding, Bonding and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
2.
RELATED MAINTENANCE PROCEDURE:
Bonding.
APPLICABLE TEST PROCEDURE:
3.
Bond Resistance Test (see Section 2.2.2.3.1).
TEST EQUIPMENT REQUIRED:
4.
Double Balanced Resistance Bridge or approved Ohmmeter capable of measuring resistances of one
milliohm and five milliohms.
5.
MATERIALS REQUIRED:
None.
PROCEDURE:
6.
Inspect electromagnetic and personnel protection shields for continued shielding integrity,
a.
grounding, and bonding (see Section 2.2.2.2.7). Information on design and materials is available in Sections 1.8.2
and 1.8.4.
Complete Section IV of the Facility Report of Section 2.3.3.
b.
File Major Discrepancy Reports as needed.
c.
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