Facility Maintenance Procedure (Shielding).
TECHNICAL DATA REFERENCES:
Grounding, Bonding and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
RELATED MAINTENANCE PROCEDURE:
APPLICABLE TEST PROCEDURE:
Bond Resistance Test (see Section 22.214.171.124.1).
TEST EQUIPMENT REQUIRED:
milliohm and five milliohms.
Inspect electromagnetic and personnel protection shields for continued shielding integrity,
grounding, and bonding (see Section 126.96.36.199.7). Information on design and materials is available in Sections 1.8.2
Complete Section IV of the Facility Report of Section 2.3.3.
File Major Discrepancy Reports as needed.