Quantcast Performance Evaluation Program Grounding ,Bonding, Shielding -Cont. - hdbk419a_vol20277

Share on Google+Share on FacebookShare on LinkedInShare on TwitterShare on DiggShare on Stumble Upon
Custom Search
 
  
 


MIL-HDBK-419A
YES
NO
X
Do shielded enclosures appear to retain their integrity?
33.
a.
Do grounding conductors cross shielded enclosure without being
b.
X
bonded to enclosure?
MIL-STD-188-124A, 5.3.1
In the routing and layout of wire, are power lines and high level signal
34.
X
lines kept separate from low level signal lines?
MIL-STD-188-124A, 5.3.2.5
X
X
Is there a need for a Lower Frequency Network?
35.
MIL-STD-188-124A,  5.1.1.4.3
X
X
Is there a need for a Higher Frequency Network?
36.
MIL-STD-188-124A,  5.1.1.4.2
X
X
Is a Lower Frequency Network installed?
37.
MIL-STD-188-124A,  5.1.1.4.3
X
X
Is a Higher Frequency Network installed?
38.
MIL-STD-188-124A,  5.1.1.4.2
Is the equipotential plane bonded to the facility ground earth
39.
X
electrode subsystem?
MIL-STD-188-124A,  5.1.1.4.2
40.
Have any resistance measurements been conducted on the equipotential
plane?
X
MIL-STD-188-124A, 5.1.2.1.1
Are ground-fault-circuit-interrupters (GFCI) installed on 15 and 20 AMP
41.
X
convenience outlets?
MIL-STD-188-124A, 5.1.1.2.5.7 and 5.1.2.2.2
2-58





 


Privacy Statement - Copyright Information. - Contact Us

Integrated Publishing, Inc.