Figure 7-19. Techniques for Protecting Bonds Between Dissimilar Metals

Custom Search

Back
Relative Area of Anodic Member

Up
Grounding, Bonding, and Shielding for Electronic Equipments and Facilities

Summary of Guidelines

MIL-HDBK-419A

Figure 7-19. Techniques for Protecting Bonds Between Dissimilar Metals

7-35

Privacy Statement - Copyright Information. - Contact Us

Integrated Publishing, Inc. - A (SDVOSB) Service Disabled Veteran Owned Small Business