Figure 2-11. Typical Bond Resistance and Stray Current Measurement Locations in an Electronic Facility

Custom Search

Back
Signal Grounding Practices

Up
Grounding, Bonding, and Shielding for Electronic Equipments and Facilities

Shielding

MIL-HDBK-419A

S: STRUCTURAL STEEL ELEMENTS

LF: LOWER FREQUENCY

HF: HIGHER FREQUENCY

PP: POWER PANEL

Figure 2-11. Typical Bond Resistance and Stray Current Measurement Locations in an Electronic Facility

2-18

Integrated Publishing, Inc. - A (SDVOSB) Service Disabled Veteran Owned Small Business