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 MIL-HDBK-419A
PART III - BONDING
General Overall Condition (check):
A.
Poor
Excellent
Good
Resistance Measurements:
B.
(Record the resistance of all bonds measured. See particularly Step d of Section 2.2.2.2.2
for those bonds which measure greater than one milliohm.)
Location of Bond
Resistance in milliohms
Deficiencies:
C.
Condition or
Location
Deficiency
Corrective Action Taken
2-50
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