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 MIL-HDBK-419A
2.3.2.3 Facility Maintenance Procedure (Bonding).
TECHNICAL DATA REFERENCES:
1.
Grounding, Bonding, and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
RELATED MAINTENANCE PROCEDURES:
2.
None.
3.
APPLICABLE TEST PROCEDURE:
Bond Resistance Test (see Section 2.2.2.3.1).
4.
TEST EQUIPMENT REQUIRED:
a.
Double Balanced Resistance Bridge or approved Ohmmeter capable of measuring resistances of less
than one milliohm.
Camera, if desired.
b.
MATERIALS REQUIRED:
5.
Film and flash bulbs or electronic flash for camera, if used.
6.
PROCEDURES:
Follow the procedure of Section 2.2.2.2.2.
a.
b.
Record the results of the inspection and measurements in Part III of the Facility Maintenance
Report. Attach supporting evidence such as photographs, sketches, etc.
c.
File a Major Discrepancy Report on all noncorrectable deficiencies.
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