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 MIL-HDBK-419A
2.3.2.4
Facility Maintenance Procedure (Fault Protection Subsystem (Safety Ground)).
1.
TECHNICAL DATA REFERENCES:
Grounding, Bonding, and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
a.
National Electrical Code NFPA 70.
b.
RELATED MAINTENANCE PROCEDURES:
2.
Earth Electrode Subsystem.
a.
b.
APPLICABLE TEST PROCEDURES:
3.
Bond Resistance Test (see Section 2.2.2.3.1).
TEST EQUIPMENT REQUIRED:
4.
a.
Double Balanced Resistance Bridge or approved Ohmmeter capable of measuring resistances of one
milliohm, five milliohms and one megohm.
Clamp-on AC Ammeter.
b.
Camera, if desired.
c.
5.
MATERIALS REQUIRED:
Film and flashbulbs or electronic flash for camera, if used.
6.
PROCEDURE:
a.
Follow the inspection procedure of Section 2.2.2.2.4.
b.
Perform spot check resistance measurements on power receptacles and stray current measurements
on safety ground to insure that the ground terminals on the receptacles are properly grounded to the facility
ground system and no currents are flowing on grounding conductor (see Sections 1.4.5 and 3.2.2).
c.
Record the results of the inspection measured stray current levels and resistance values in Part IV
of the Facility Maintenance Report.
d.
File a Major Discrepancy Report on all major deficiencies (particularly those representing a
violation of MIL-STD-188-124A and the National Electrical Code).
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