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 MIL-HDBK-419A
2.3.2.5
Facility Maintenance Procedure (Signal Reference Subsystem (Signal Grounding)).
TECHNICAL DATA REFERENCES:
1.
Grounding, Bonding, and Shielding, MIL-HDBK-419A Volumes I and II, MIL-STD-188-124A.
RELATED MAINTENANCE PROCEDURE:
2.
APPLICABLE TEST PROCEDURES:
3.
Bond Resistance Test (see Section 2.2.2.3.1).
a.
Ground System Noise Current Test (see Section 2.2.2.3.2).
b.
Differential Noise Voltage Test (see Section 2.2.2.3.3).
c.
TEST EQUIPMENT REQUIRED:
4.
a.
Double Balanced Resistance Bridge or approved Ohmmeter capable of measuring resistances of one
milliohm, 10 milliohms, and 100 milliohms.
50-MHz Oscilloscope.
b.
Isolation Transformer for Oscilloscope.
c.
Clamp-on Current Probe for Oscilloscope.
d.
Oscilloscope Camera.
e.
MATERIALS REQUIRED:
5.
Required lengths of coaxial cable for oscilloscope probes.
a.
Film for oscilloscope camera.
b.
PROCEDURE:
6.
Follow the inspection and test procedures set forth in Sections 2.2.2.2.5 and 2.2.2.2.6.
a.
Record the results of the inspection and measurements in Part V of the Facility Maintenance
b.
Report.
File Major Discrepancy Reports as needed.
c.
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